𐄀 Focus on providing PCBA separator manufacturing process solution
Extreme Miniaturization & Thinness
PCB dimensions often under 10mm×10mm, featuring micro-components like 01005, CSP, and chip antennas. Depaneling risks cutting traces or damaging components.
High Proportion of FPC/Rigid-Flex Boards
Flexible boards prone to stretching, cracking, and delamination. Traditional punching/milling methods yield low yield rates and high scrap costs.
Mass-produced Consumer Electronics + Rapid Iteration
With shipments reaching tens of millions and rapid product cycles, depaneling equipment must balance high-speed mass production with quick changeovers.
Stringent Aesthetic and Structural Requirements
Burrs, deformation, or indentations at depaneling cuts can compromise assembly integrity and appearance, leading to product defects.
Ultra-Precision Visual Positioning: High-accuracy vision system (pixel-level positioning) with automatic alignment correction, compatible with micro/irregular PCBs, positioning accuracy ≤±0.01mm.
Specialized Flexible Board Depaneling Solutions: Supports low-stress/non-contact methods like laser/pneumatic depaneling to prevent FPC stretching, cracking, or delamination, ensuring smooth, burr-free cuts.
High-Speed Mass Production Capability: Hourly throughput meets consumer electronics scale, featuring automated loading/unloading and multi-station parallel processing to boost overall line efficiency.
Damage-Free Micro-Component Handling: Intelligent path avoidance during routing, precise control of cutting tools/laser power to prevent damage to surrounding micro-components, chip antennas, and sensors.
Rapid Changeover & Program Reusability: Supports CAD import and offline programming for short new product introduction cycles, adapting to fast-paced product iterations.
Lightweight Structure & Compact Footprint: Compact equipment design fits tight SMT line spaces, simplifying overall line layout.
