𐄀 Focus on providing PCBA separator manufacturing process solution
Extreme Environments + Extended Service Life
Spacecraft/airborne equipment must withstand vacuum, extreme temperature fluctuations, intense radiation, and launch-level shocks. Any minor defect during de-panelization can cause mission failure in orbit or flight.
High Value, Low Volume, Non-Repairable
Aerospace-grade PCBs and components carry extremely high costs and are often assembled for single use. Board separation failure necessitates entire module rework, resulting in significant cost and schedule losses.
Lightweighting and Specialized Materials Dominate
Primarily utilizes aluminum-based, magnesium-based, polyimide, and high-frequency microwave substrates. These materials exhibit brittleness and unique thermal conductivity, making traditional separation prone to edge chipping, delamination, and thermal damage.
Most stringent quality systems with fully controllable processes
Adherence to aerospace quality standards mandates 100% controllable equipment processes, 100% traceable parameters, and 100% fault localization.
Zero-defect precision and stability: Positioning accuracy ≤ ±0.005mm with exceptional repeatability. Post-cutting results show zero microscopic cracks, delamination, or circuit damage.
Specialized material processing: Supports aluminum, ceramic, high-frequency microwave, and polyimide substrates. Deeply customizable laser/milling parameters prevent thermal damage and mechanical chipping.
Fully Closed-Loop Process Control: Real-time monitoring of cutting force, laser power, and operational trajectories. Immediate shutdown and alarm upon anomalies to prevent defective product release.
Full Lifecycle Data Traceability: Complete, non-erasable records of cutting parameters, environmental conditions, operator details, and batch information to meet aerospace-grade quality accountability requirements.
High reliability with redundancy assurance: Redundant design for critical electrical and motion components, subjected to extended aging tests before shipment to guarantee zero-failure mission batches.
Lightweight and space-optimized: Supports ultra-thin, lightweight PCB depaneling without inducing additional stress, ensuring weight reduction targets for spacecraft/airborne equipment.
