𐄀 Focus on providing PCBA separator manufacturing process solution
Stringent High-Frequency/High-Speed Signal Integrity Requirements: 5G/6G base stations, optical modules, and fronthaul/backhaul equipment operate in Sub-6GHz, millimeter-wave, and optical communication bands. Micro-cracks, delamination, burrs, and residual stress from panel cutting directly cause impedance discontinuities, excessive signal return loss, and increased bit error rates, impacting base station coverage and transmission quality.
High-Power / Thick Copper / High Thermal Conductivity Substrates Multi-base station power amplifiers, power supplies, and RF units extensively utilize thick copper boards (2–6 oz), aluminum/copper-based PCBs, and high-frequency materials (PTFE/hydrocarbon substrates like Rogers, Tyco). Traditional depaneling often results in: - Edge chipping and excessive burrs on thick copper cuts - Delamination of high-frequency materials and substrate carbonization - Rapid tool wear and precision drift
Large-format boards + high-density BGAs/RF components Base station BBUs, AAUs, and OTN/PTN equipment feature large PCBs with high layer counts (10–30 layers). These boards densely pack high-power amplifier modules, BGAs, RF connectors, and shielding covers. During depaneling, stress, clamping forces, and tool paths can damage high-value components.
High reliability and extended service life Base station/core network equipment demands 24/7 uptime and 5–10 years of maintenance-free operation. Defective de-paneling can cause subsequent batch failures and extremely high maintenance costs. Operators and equipment manufacturers require near-zero-defect process capability (Cmk/Cpk) and yield rates.
EMC/Shielding and Structural Assembly Requirements Insufficient precision during depaneling in high-RF zones or around shielding covers may cause: ◦ Excessive assembly gaps in shielding, resulting in substandard EMC performance ◦ Structural assembly interference and poor heat dissipation in the entire device
5G/6G macro/small cells: AAU RF boards, BBU baseband boards, power boards, clock boards
Optical communications: 100G/400G/800G optical module PCBs, optical transport equipment boards, PON device main control boards
Core/transport networks: routers, switches, OTN/PTN line cards, signal processing boards
Indoor distribution systems: distributed femtocells, digital indoor AP boards, RF remote units • Private networks: emergency communications, rail transit/power communication base station modules
Low stress + delamination-free depaneling controls mechanical and thermal stress, eliminating PCB microcracks, substrate delamination, and damage to BGA/RF component solder joints to ensure impedance continuity and long-term reliability.
High-frequency/thick copper/specialty substrate compatibility. Supports Rogers, carbon-hydrogen, PTFE, and other high-frequency materials, plus ≥3oz thick copper boards and metal-core PCB separation. Cuts produce smooth edges free of burrs, carbonization, or copper wire fraying.
Large Format + High Precision Positioning: Combines a long-travel platform with high-accuracy vision positioning, achieving positioning accuracy ≤±0.01mm and high repeatability. Suitable for large-format, multilayer, and irregular-shaped boards.
Intelligent Path Avoidance & Anti-Collision: Supports CAD import and automatically avoids high-density components like BGAs, shields, connectors, and power transistors, preventing physical collision damage during routing.
High process capability and stability: Cmk ≥ 1.67, tool life management, automatic compensation, and anomaly alerts ensure batch consistency.
Dust removal and ESD protection: Efficient dust extraction system (especially for thick copper milling), full-process ESD shielding prevents dust and static damage to RF-sensitive components.
Data Traceability and Production Line Integration support routing parameter, batch, and operation log recording. Interfaces with MES/SMT production lines to meet quality system audits for telecommunications equipment manufacturers.
